Dead load creep analysis of a solder joint at elevated temperature.Analysis using ABAQUS Standard, v. 6.6-1 on 26 November 2006.
The creep behavior is modeled in ABAQUS *CREEP, LAW = TIME, with applied temperature and constants adjusted to give visible creep deformation behavior
(at this point, a real material has not been modelled).Note that the deformation scale has been exaggerated.